Cadence's AuraStack agent melds AI with HPC to speed PCB, advanced packaging design

Cadence has launched AuraStack, an AI agent designed to accelerate PCB and advanced packaging design. By integrating AI with HPC, the tool demonstrates how low-precision AI can effectively complement high-precision simulations. This one-two punch approach aims to streamline the development of circuit boards and chip packaging, significantly increasing the speed of the design process through the synergy of artificial intelligence and high-performance computing capabilities within the Cadence ecosystem.