GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

GlobalFoundries has entered a five-year agreement valued at $2 billion to produce silicon interposers for TSMC's CoWoS in the United States. This partnership integrates GlobalFoundries into the supply chain for leading-edge AI and HPC accelerators without requiring investments in leading-edge process technologies. This advanced packaging technology is critical for the domestic production of high-performance semiconductors utilized in AI datacenters, strengthening the US capacity for manufacturing essential components for high-performance computing and artificial intelligence infrastructure.