(PR) SK hynix Breaks Ground on U.S. HBM Fab in Indiana, Targets Mass Production by Q2 2029

SK hynix has officially broken ground on its first US-based advanced packaging production facility in West Lafayette, Indiana. The project, valued at over $4 billion, aims to establish a hub for next-generation High Bandwidth Memory, specifically targeting mass production of HBM4E chips by the second half of 2029. The groundbreaking ceremony at Purdue University was attended by key US government figures, marking a significant step in AI memory cooperation between the United States and South Korea.