SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

SK Hynix has held a groundbreaking ceremony for a $4 billion AI chip packaging facility in Indiana. This memory hub aims to diversify supply chains, boost US semiconductor capabilities, and transform the West Lafayette economy. The facility will create significant job opportunities and enhance AI infrastructure. SK Hynix plans to initiate volume production of HBM4E chips at the Indiana factory starting in the second half of 2029, further strengthening the regional technological landscape and production capacity.