Micron Evolving Memory Architectures for AI at Hot Chips 2026

At Hot Chips 2026, Micron and Samsung presented advancements in memory technologies tailored for AI. Micron focused on the evolution of memory architectures and current packaging opportunities to support artificial intelligence workloads. Simultaneously, Samsung detailed its strategy to evolve the HBM base die, aiming to reclaim package area for more efficient compute operations. Both companies highlighted critical architectural shifts necessary to optimize hardware performance and packaging efficiency within the rapidly growing AI infrastructure landscape.