(PR) SK hynix Ships Samples of 12-Layer Next-Gen HBM4E

SK Hynix has shipped samples of its next-generation HBM4E DRAM to major AI customers. This 12-layer stack provides 48GB of capacity and reaches data processing speeds of 16Gbps per pin. The company reports that power efficiency has improved by over 20 percent compared to previous models. These advancements enhance data processing for AI training and inference. SK Hynix intends to collaborate closely with partners to ensure the timely mass production of this high-bandwidth memory technology.